Hardware Research Bach Nguyen
In electronic systems, a heat sink is a passive heat exchanger component that cools a device by dissipating heat into the surrounding air. In computers, heat sinks are used to cool central processing units or graphics processors. Heat sinks are used with high-power semiconductor devices such as power transistors and optoelectronic devices such as lasers and light emitting diodes (LEDs), wherever the heat dissipation ability of the basic device package is insufficient to control its temperature.
A heat sink is designed to increase the surface area in contact with the cooling medium surrounding it, such as the air. Approach air velocity, choice of material, fin (or other protrusion) design and surface treatment are some of the factors which affect the thermal performance of a heat sink. Heat sink attachment methods and thermal interface materials also affect the eventual die temperature of the integrated circuit. Thermal adhesive or thermal grease fills the air gap between the heat sink and device to improve its thermal performance. Theoretical, experimental and numerical methods can be used to determine a heat sink's thermal performance.
A central processing unit (CPU), also referred to as a central processor unit, is the hardware within a computer that carries out the instructions of a computer program by performing the basic arithmetical, logical, and input/output operations of the system. The term has been in use in the computer industry at least since the early 1960s. The form, design and implementation of CPUs have changed over the course of their history, but their fundamental operation remains much the same.
In older computers, CPUs require one or more printed circuit boards. With the invention of the microprocessor, a CPU could be contained within a single silicon chip. The first computers to use microprocessors were personal computers and small workstations. Since the...